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This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721C Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new procedures for BGAs (including reballing), flex-print repair, using focused IR Reflow Systems with integral preheater, and general updates to all other procedures. Part 1 General Requirements has also been updated for ease of use and provides important direction and guidelines for all procedures. This section includes procedures common to rework, repair and modification. Part 2 is IPC-7711C and the procedures include tools, materials and methods to be used in removing and replacing surface mount and through-hole components. Part 3 is IPC-7721C and includes procedures for modifying assemblies and accomplishing laminate and conductor repairs. This guide is provided in a three ring binder for easy updating. Users can insert company specific procedures, or remove just the pages needed for a specific job to help keep the workbench clear. Many procedures have color illustrations to help the user understand the guide.
