Providing Design & Manufacturing of Instrumentation, Aerospace / Aviation, Ground Support, Communication, Flight Critical, Life Support, Emergency Hardware, Training & Simulation Electronics for Military Customers.

Design Capabilities

  • High Density / High Speed Digital PCB Design
  • Controlled Impedance PCB Designs
  • High Voltage Power Supply Design
  • Analog / Digital Design
  • Mixed SMT and Thru Hole Technology Designs
  • Micro BGA and CSP Designs
  • Micro Via Designs
  • Flex Circuit Design
  • Rigid-Flex Design
  • Power Hybrid Design
  • Microelectronics Hybrid Designs
  • Microwave Designs
  • RF Antenna Design
  • Stripline Design

Technical Capabilities

  • PCB Manufactures Qualification and Inspection
  • Interface between Design and PCB Manufacturer
  • Calculate Board Impedance Characteristic
  • Design for Manufacturability
  • Develop and Setup Design and Assembly Processes
  • Mechanical Design, Brackets, Chassis and Housings
  • Machine and Tooling Design
  • Software Setup and Development for CAD Software
  • Circuit Test and Troubleshooting
  • Reverse Engineering


Assembly Capabilities

  • Surface Mount Technology
  • Automated Through Hole Assembly
  • Mixed Technology
  • Secondary Assembly
  • Mechanical Assembly
  • Final Assembly
  • Consignment or Full Turnkey Manufacturing
  • Automated Coating For UR & AR
  • Paralene Coating For Applications Needing A Higher Degree Of Protection
  • Spares and Obsolescence Support

Technology Capabilities

  • Single & Double Sided SMT
  • Plated Through Hole
  • Cylindrical Components
  • Quad Packs - Gull Wing, J Lead
  • Ultrafine Pitch Quad Flat Packs
  • SOIC
  • SOT
  • Fine/Ultra Fine QFP
  • 0402 Chip Devices
  • Flip Chip
  • Through Hole Assembly And Single Automated DIP Insertion .300 span
  • Optimal Thermal Profile Processes For SMT Reflow And Wave Solder
  • Automated In Line Wave Soldering
  • Automated Component Prep

Test Services

  • Burn In
  • Functional
  • System Test
  • Environmental Stress Screening - Thermal Cycling / Burn In / Humidity

Quality Standards

  • ISO9001:2000
  • AS9100B
  • IPC-A-610 Workmanship Standard
  • J-STD-001 Workmanship Standard


EEI Manufacturing Services can take your product through pre-production and post-production stages. EEI Manufacturing Services has experience with both electro-mechanical and advanced technology box-build; as well as chassis systems integration.



Material Procurement And Inventory Management Support

  • Dock to Stock Programs
  • Cost Effective "End-Of-Product-Life" and "Obsolete" Product Support
  • Strategic Supplier Relationships
  • Excess Material Reduction Solutions, Consignment Programs

Component Kitting - Turnkey Services Available

Ultra-high Speed Device Programming - 4000+ Devices Supported

  • E/EEPROM, FLASH, Micros, EPLD, CPLD
  • Microcontrollers
  • Custom Devices
  • EPROM Reprocessing
  • DIP, PLCC, QFP, TSOP, PSOP, SOIC, SSOP, SDIP, uBGA, CSP
  • Prototype to Production Quantities
  • Turnkey Services Available

Component Prep - Turnkey Services Available              Bar Coding & Custom Labeling

  • Forming
  • Cutting
  • Crimping
 
 
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